Fast becoming one of the premier packaging conferences in North America, the Food Packaging Technologies Summit enters its third year in 2013 as a major event for those involved in the development, marketing and processing of food packaging and the many issues involved in that large market sector.

The only global event focused solely on the connection between the food industry and packaging, this world-class meeting and networking event will bring together key brand owners, retailers, packaging converters, service suppliers, and others developing and bringing to market the next generation of food packaging and related technologies and innovations.

This event will shine a spotlight on many of the key issues, market trends, critical technologies, innovative case studies, business developments and future drivers that dictate the success of food packaging to meet the needs of the global consumer community. The Food Packaging Technologies Summit is about opportunity and how to enhance that success for your business and its growth.

The 2013 conference promises to be a major networking and information event for anyone involved in food packaging.

Venue for 2013 Event

InterContinental Chicago O'Hare
5300 N. River Road
Rosemont, Illinois 60018
Phone/Reservations: 1-800-424-6835 or 847-544-5300 
Website | Map

The InterContinental Chicago O'Hare is just a short distance outside the Windy City. As the only luxury property in the suburbs, they offer savvy travelers a delightful alternative to traditional Chicago O'Hare airport hotels. Here, contemporary art and cutting-edge design merge with world-class service for an unsurpassed lodging experience. 

Why You Should Attend

• Discover global market drivers and emerging trends in the food packaging process
• Hear case studies on new packaging formats and materials
• Gain insights into new technologies and systems approaches driving the future of food packaging
• Network with top CPG producers/brand owners in a relaxed environment
• Find the latest packaging materials, solutions and services at the Wednesday evening exhibition reception

Who Should Attend

Package developers, packaging managers and engineers, operations managers and directors, and R&D managers from CPG and converter companies.

Packaging industry materials, machinery and service and solution providers, packaging consultants and market researchers

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